Electronic meta-ware slice analysis

Electronic meta-ware slice analysis

Introduction:

Electronic meta-ware slices and gold-slice, cross-section, x-section, are a method of collating samples with ad hoc liquid resins and then grinding them.

Purpose:

Weld quality of electrons on board circuit boards is tested, and micro-observations of cross-welding, wetting problems, empty holes, cracks, etc. are performed on electrons.

Scope of application:

For quality and failure analysis for PCB and PCB-Mechanical Devices.

Equipment used: Cyclops, vacuum mossers, grinding polishers, etc.

Product name: Cyclops

Product type: FY-QG-150JM

Pressure pan Technomat 

Vacuum Embedding FY-VM-II

The Golden-Symbrane.   FY-MP-2XS

Use of materials: diamond cutters, gold-phase cutters, emulsions, epoxy resins, epoxy-based gels, gold sandpapers, gold-phase polished plasters, gold steel suspended plating fluids and aluminium oxide polishing fluids, corrosive solutions, ethanol or similar organic solvents.

Test Steps

1 Sampling 2, Embedded Burial 3, Griding 4, Plowing 5, Microcorrosion 6, Observation

Typical application scene 

Welding measurements 

BGA Tin Ball Microfissile 

Plating thickness measurement

Capacitive failure analysis Alloy micro-organism observation.

PCB blind quality analysis

BGA Welding Malformation