In the production of the printed circuit boards, problems with product quality arise and are resolved, and improvements in the production process require that the study and judgement be based on observation of microslices, which are good and bad, and how high they are, which are key factors in the judgement and study of pcb quality and process. The sample slice analysis is a destructive experiment, grinding with sandpaper, and subsequent polishing, which allows for the processing of clear sample profiles, a rapid sample preparation method, and the processing of samples with appropriate detection equipment (optic microscopes or scanning electron microscopes) allows the viewing of the profile structure of the samples.

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  Printed circuit boards/assembly boards welding, failure analysis: PCB/PCBA/BGA, etc.
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  Structure analysis of electrons: electrical resistance, capacitor, semiconductor, ceramic...
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  Connector type component analysis: connector, printed circuit board, etc.
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  Sensors and components