Seal technical classification

Seal technical classification

QFP Envelope

QFP, or a four-side tom-barrelled seal, is a surface-based cover from which the feet are drawn from four sides to the seagull Wing (L).

QFP seals are for high frequency applications, are operational and reliable, and are suitable for SMT surface installation technology to install wiring on PCB.

BGA seal

BGA, a spherical array sealing technique using spherical welding points as an I/O endpoint.

BGA is better equipped with smaller size and heat, suitable for high-density I/O needs, and widely used for high performance processors and high capacity storage

CSP Envelope

CSP, or chip-sized packaging, is a containment technique that has a size similar to that of the chip itself.

CSP sealing helps to achieve miniaturization and thinning of chips and is suitable for applications that are highly space-required.

DIPEncapsulate

DIP: The foot is drawn from both sides of the envelope in a two-bard direct-in-box format and suitable for installation on circuit boards through the plugs, for manual welding and maintenance.

SOIC Encapsulate

SOIC: The use of side-legging, where the foot is drawn from both sides of the envelope, but where the foot is of a small spacing, suitable for automatic loading, and conducive to the miniaturization of circuit boards.

PLCCEncapsulate

PLCC: Better physical protection through plastic carriers, where the feet are drawn from the four sides of the envelope, usually used to seal integrated circuit chips.